Our production capabilities are threefold: centered on people, process and products.
Personnel Capabilities
Logic Electronic Manufacturing Services develops a Customer Focused Team with the appropriate disciples and expertise to fit the specific needs of each customer. This Customer Focused Team responsively and competitively has the expertise and certifications to manage your requirements, delivering high quality products on time.
Placement Capabilities
- .4 mm Pitch for QFP
- .5 mm Pitch for BGA
- 0201 Chip Component
- up to 2" square BGA
- 1500 IO BGA
Process Capabilities
PCB Finishes
- HASL
- Gold
- OSP
- Immersion Silver
Assembly
- High mix assemblies including complex assemblies PCA's (20"x 20") (double sided mixed technology)
- Layers - 40
- PCB Material
- GR4
- Polyimide Utilize Siermens' automated manufacturer optical inspection system
Chemistries
- Aqueous
- RMA
- No Clean
- PCB Material
Attachment
- Thru-Hole and SMT
- 0201to 55 mm square
- Micro BGA's 0.5 mm spacing
- CSP's
- BGA's 55 mm square - 1500 Sphere's
- Ultra-Fine Pitch QFP's 0.4 mm spacing
Paperless
- Shop Floor Documentation
- ISO 9001 Documentation
- CIMBridge Software
- QSI Software
Inspection
- Automated Optic/ Inspection
- Solder Paste Inspection
Product
- Complete Turnkey Solution
- Design
- Procurement
- Assembly
- Test
Large Box Build
- Procurement
- Assembly
- Integration
- System Test
Fulfillment Services