Technical

PCA (Printed Circuit Assembly)

• Fine Pitch (12 mils) and BGA placement and repair.
• Paste In Hole
• Pin In Hole technology
• Double-sided mixed technology
• No clean process
• Water wash process
• Flex assembly
• Conformal coating
• Large Complex PCA's
• High part count > 3,000
• High layer count Printed Circuit Card
• BGA intensive - placement and repair
• Micro - BGA and CSP
• Paperless shop floor documentation system
• Design for Manufacturing reviews

Inspection

• AOI - pre and post reflow
• 100% solder paste inspection