Efficiency.  Manufacturing tomorrow's products today.  

At Logic PD, our strategically located manufacturing facilities deliver low-volume, high-mix manufacturing solutions with time-to-market objectives and minimized procurement, materials management, and manufacturing costs. We possess multiple capabilities to accommodate a wide range of lot size, delivery schedule, and cost requirements. Our Customer Focused Teams provide quick response to changing demands that drive our formal cost-reduction efforts.

Maximum flexibility is achieved through sophisticated, company-wide scheduling and communications systems that position customer need as the focal point for all business operations.

Exceptional people, skills, and high technology are the foundation of Logic PD's manufacturing group. Our skilled Customer Focused Teams work with our modern, state-of-the-art manufacturing and testing equipment to deliver quality products and innovative business solutions. Our high-technology manufacturing includes multiple SMT lines and Pin Through Hole lines, allowing for operational efficiency and speed-to-market. Our teams have extensive experience with high layer count, MicroBGA, Fine Pitch- and BGA-intensive designs, POP technology, and when integrated with our innovative solutions, they produce accurate, cost-effective, and quality products.

• Fine Pitch (12 mils) and BGA placement and repair.
• Paste In Hole
• Pin In Hole technology
• Double-sided mixed technology
• No clean process
• Water wash process
• Flex assembly
• Conformal coating
• Large Complex PCAs
• High part count > 3,000
• High layer count Printed Circuit Card
• BGA-intensive - placement and repair
• Micro - BGA and CSP
• Paperless shop floor documentation system
• Design for Manufacturing reviews

Placement Capabilities

• .4 mm Pitch for QFP
• .4 mm and POP technology
• 0201 Chip Component
• up to 2" square BGA
• 1500 IO BGA