Manufacturing

Manufacturing is where the proverbial rubber meets the road. At Logic PD, it involves more than building innovative products. It’s about finding innovative ways to streamline the process, accelerate time-to-market, and reduce procurement, materials management and manufacturing costs. 

Our strategically located manufacturing facilities and Customer Focused Teams are geared up to accommodate a wide range of lot size, delivery schedule and cost requirements. We offer maximum flexibility through sophisticated, company-wide scheduling and communications systems designed around your needs.

Our expertise includes:

• Fine Pitch (12 mm) and BGA placement and repair. 
• Pin-in-Paste 
• Double-sided mixed technology 
• Water soluble and No-clean process 
• Various cleaning processes including Aqueous wash, vapor degreasing, and jet clean
• Flex assembly 
• Conformal coating 
• Large Complex PCAs 
• High part count > 3,000 
• High layer count Printed Circuit Card 
• Micro - BGA and CSP 
• Paperless shop floor documentation system 
• Design for Manufacturing reviews 

Placement Capabilities

• .3 mm Pitch for QFP
• .4 mm BGA and PoP technology
• 0201 Chip Component
• up to 2" square BGA
• 1500 IO BGA